Effect of Process Parameters on Polishing Performance of Pure Lead During Chemical Mechanical Polishing

被引：0
作者：
Cai R. [1 ]
Yu J. [1 ]
Wang C. [2 ]
机构：
[1] Key Laboratory of Testing Technology for Manufacturing Process, Ministry of Education, Southwest University of Science and Technology, Mianyang
[2] Institute of Mechanical Manufacturing Technology, China Academy of Engineering Physics, Mianyang
来源：
Mocaxue Xuebao/Tribology | 2020年 / 40卷 / 05期
基金：
中国国家自然科学基金;
关键词：
Chemical mechanical polishing; Lead; Material removal rate; Process parameters; Surface roughness;
D O I：
10.16078/j.tribology.2019230
中图分类号：
学科分类号：
摘要：
In order to obtain high-quality pure lead surface, based on self-made polishing slurries, the influence of shape, particle size and concentration of colloidal silica polishing particles, as well as down force, the rotation speed and direction of polishing head / disc and the slurry flow rate on the surface material removal rate and roughness of lead sheet were investigated by chemical mechanical polishing (CMP). The results revealed that, compared with the larger spherical colloidal silica polishing particles, the smaller particle with brow-shaped were more beneficial to the polishing of lead sheet. The influence of particle size and concentration of polishing particles on the polishing performance of pure lead mainly depended on the coupling relationship among lead sheet surface, colloidal silica particles and the lint on polishing pad surface. With the change of down force, the rotation speed and direction of polishing head / disc as well as the slurry flow rate, the thickness and status of polishing slurries varied at the lead sheet / polishing pad interface, which directly affected the fluidity, lubricity and dispersion of polishing slurries and the chemical-mechanical interaction between polishing particles, chemical reagent and lead sheet surface, thereby affecting the polishing quality and the material removal rate. By the investigation of the influence of process parameters and parameters optimization, this work finally obtained an ideal ultra-smooth pure lead surface with surface roughness of Ra 1.5 nm and the material removal rate of 380 Å/min. Copyright ©2020 Tribology. All rights reserved.
引用
收藏
页码：559 / 568
页数：9
相关论文
共 39 条
[1]  
Li Songrui, Tian Rongzhang, Lead and lead alloys, (1996)
[2]  
Xu Chuanhua, Application of land in modern industry, Mining & Metallurgy, 4, 3, pp. 127-130, (1995)
[3]  
Abou-El-Hossein K, Olufayo O, Mkoko Z., Diamond tool wear during ultra-high precision machining of rapidly solidified aluminium RSA 905, Wear, 302, 1-2, pp. 1105-1112, (2013)
[4]  
Steinkopf R, Gebhardt A, Scheiding S, Et al., Metal mirrors with excellent figure and roughness, Optical Fabrication, Testing, and Metrology III. International Society for Optics and Photonics, 7102, (2008)
[5]  
Revel P, Khanfir H, Fillit R Y., Surface characterization of aluminum alloys after diamond turning, Journal of Materials Processing Technology, 178, 1-3, pp. 154-161, (2006)
[6]  
Liu K, Wu H, Liu P, Et al., Ultra-precision machining of aluminium alloy surfaces for optical applications, International Journal of Nanomanufacturing, 7, 2, pp. 116-125, (2011)
[7]  
Zhao D, Lu X., Chemical mechanical polishing: theory and experiment, Friction, 1, 4, pp. 306-326, (2013)
[8]  
Li Y., Microelectronic applications of chemical mechanical planarization, (2007)
[9]  
He X, Chen Y, Zhao H, Et al., Y<sub>2</sub>O<sub>3</sub> nanosheets as slurry abrasives for chemical-mechanical planarization of copper, Friction, 1, 4, pp. 327-332, (2013)
[10]  
Zhang Wei, Lu Xinchun, Liu Yuhong, Chemical mechanical polishing of copper in glycine-H<sub>2</sub>O<sub>2</sub> system slurry, Tribology, 28, 4, pp. 366-370, (2008)
1234