Simulation modeling of wafer grinding surface roughness considering grinding vibration

When using the workpiece rotation method to grind wafers, the grinding end vibration will deteriorate the surface roughness of the wafers. To study the impact law of vibration on the surface roughness of wafers during the grinding procedure, this paper presents a new approach to simulate and model the surface roughness of wafer grinding considering the grinding vibration. Firstly, the dynamics model under the consideration of grinding force was established for the grinding end of the grinding wheel and workpiece turntable. Secondly, using the iterative method to solve the dynamic equations that have been established, the vibration equation is obtained by fitting the displacement vibration curve of the end. Then, by reconstructing the surface grain of the gear teeth, a simulation model of wafer grinding surface roughness was established considering material removal, grain motion and grinding vibration. And then the grinding comparison test was conducted to compare the simulation and test surface roughness measurement results. The maximum deviation of the surface roughness Sz and Sa was 7.7% and 5.4%, respectively. The results indicate the accuracy of the modeling. Finally, based on the established wafer roughness model, explore the impact of vibration on wafer roughness during the grinding procedure. This model provides a reference for the research of wafer precision grinding technology.