Low cycle fatigue lives of Sn-37Pb and Sn-3.5Ag solders at low temperatures

被引：5

作者：

Hiyoshi, Noritake ^{[1
]}

Katoh, Akihisa ^{[2
]}

Sakane, Masao ^{[3
]}

Tsukada, Yutaka ^{[4
]}

机构：

[1] Dept. of Mech. Eng., Ishikawa National College of Tech., Kahoku-gun

[2] Ishikawa National College of Tech., Kahoku-gun

[3] Dept of Mech. Eng., Ritsumeikan Univ., Noji-higashi

[4] KYOCERA SLC Technologies Corporation, Ichimiyake

来源：

Zairyo/Journal of the Society of Materials Science, Japan | 2009年 / 58卷 / 02期

关键词：

Cracks; Lead-free Solder; Life evaluation; Low cycle fatigue; Low temperature; Stress-strain relationship;

D O I：

10.2472/jsms.58.155

中图分类号：

学科分类号：

摘要：

This paper describes low cycle fatigue lives of Sn-37Pb and Sn-3.5Ag solders at low temperatures. Push-pull low cycle fatigue tests were carried out at 253K and 273K to study the temperature effect on low cycle fatigue life. Plastic strain range was a suitable parameter for correlating the low cycle fatigue lives for the Sn-37Pb solder at the four temperatures but it was not for the Sn-3.5Ag solder. Strain energy parameter which is defined as the product of strain and stress ranges was a suitable parameter for the Sn-3.5Ag solder. Application of universal slope method was also discussed for predicting the low cycle fatigue lives of Sn-37Pb and Sn-3.5Ag solders. © 2009 The Society of Materials Science, Japan.

引用

页码：155 / 161

页数：6

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