Low cycle fatigue lives of Sn-37Pb and Sn-3.5Ag solders at low temperatures

被引：5
|
作者：
Hiyoshi, Noritake [1 ]
Katoh, Akihisa [2 ]
Sakane, Masao [3 ]
Tsukada, Yutaka [4 ]
机构：
[1] Dept. of Mech. Eng., Ishikawa National College of Tech., Kahoku-gun
[2] Ishikawa National College of Tech., Kahoku-gun
[3] Dept of Mech. Eng., Ritsumeikan Univ., Noji-higashi
[4] KYOCERA SLC Technologies Corporation, Ichimiyake
来源：
Zairyo/Journal of the Society of Materials Science, Japan | 2009年 / 58卷 / 02期
关键词：
Cracks; Lead-free Solder; Life evaluation; Low cycle fatigue; Low temperature; Stress-strain relationship;
D O I：
10.2472/jsms.58.155
中图分类号：
学科分类号：
摘要：
This paper describes low cycle fatigue lives of Sn-37Pb and Sn-3.5Ag solders at low temperatures. Push-pull low cycle fatigue tests were carried out at 253K and 273K to study the temperature effect on low cycle fatigue life. Plastic strain range was a suitable parameter for correlating the low cycle fatigue lives for the Sn-37Pb solder at the four temperatures but it was not for the Sn-3.5Ag solder. Strain energy parameter which is defined as the product of strain and stress ranges was a suitable parameter for the Sn-3.5Ag solder. Application of universal slope method was also discussed for predicting the low cycle fatigue lives of Sn-37Pb and Sn-3.5Ag solders. © 2009 The Society of Materials Science, Japan.
引用
收藏
页码：155 / 161
页数：6
相关论文
共 50 条
  • [31] Temperature effect on low cycle fatigue behavior of Sn-Pb eutectic solder
    Kanchanomai, C
    Mutoh, Y
    SCRIPTA MATERIALIA, 2004, 50 (01) : 83 - 88
  • [32] Metastable eutectic in Pb-free joints between Sn-3.5Ag and Ni-based substrates
    Belyakov, S. A.
    Gourlay, C. M.
    MATERIALS LETTERS, 2015, 148 : 91 - 95
  • [33] Effects of strain ratio and tensile hold time on low-cycle fatigue of lead-free Sn-3.5Ag-0.5Cu solder
    Chin-Kuang Lin
    Chun-Ming Huang
    Journal of Electronic Materials, 2006, 35 : 292 - 301
  • [34] Effect of Joint Size on Low-cycle Fatigue Properties of Sn-Ag-Cu Solder Joint
    Kariya, Yoshiharu
    Sat, Kana
    Asari, Shota
    Kanda, Yoshihiko
    2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, 2010,
  • [35] Low cycle fatigue life prediction of 63Sn-37Pb solder under proportional and non-proportional loading
    Chen, X
    Song, J
    Kim, KS
    INTERNATIONAL JOURNAL OF FATIGUE, 2006, 28 (07) : 757 - 766
  • [36] Effect of temperature on isothermal low cycle fatigue properties of Sn-Ag eutectic solder
    Kanchanomai, C
    Mutoh, Y
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2004, 381 (1-2): : 113 - 120
  • [37] Effects of strain ratio and tensile hold time on low-cycle fatigue of lead-free Sn-3.5Ag-0.5Cu solder
    Lin, CK
    Huang, CM
    JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (02) : 292 - 301
  • [38] Effect of relative humidity on corrosion behavior of SAC305 and Sn-37Pb solders under polyvinyl chloride fire smoke atmosphere
    Li, Qian
    Lin, Jin
    Li, Changhai
    Lu, Shouxiang
    Chen, Xiao
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 31 (22) : 19920 - 19930
  • [39] Low-cycle fatigue characteristics of Sn-based solder joints
    Lee, KO
    Yu, J
    Park, TS
    Lee, SB
    JOURNAL OF ELECTRONIC MATERIALS, 2004, 33 (04) : 249 - 257
  • [40] Low-cycle fatigue characteristics of Sn-based solder joints
    K. O. Lee
    Jin Yu
    T. S. Park
    S. B. Lee
    Journal of Electronic Materials, 2004, 33 : 249 - 257
12345