Effect of Current Density on Quality of Electroformed Mold Inserts with Micro/Nano-cavities

被引：1
|
作者：
Weng C. [1 ,2 ]
Wang F. [1 ,2 ]
Yang D.-J. [1 ,2 ]
Lyu H. [1 ,2 ]
Jiang B.-Y. [1 ,2 ]
机构：
[1] State Key Laboratory of High Performance Complex Manufacturing, Central South University, Changsha
[2] College of Mechanical and Electrical Engineering, Central South University, Changsha
来源：
Cailiao Gongcheng/Journal of Materials Engineering | 2017年 / 45卷 / 10期
关键词：
Current density; Electroforming; Micro/nano structure; Mold insert;
D O I：
10.11868/j.issn.1001-4381.2016.000104
中图分类号：
学科分类号：
摘要：
Based on the COMSOL Multiphysics software, the electric field distribution and the growth front of electroformed layer on the cathode surface were simulated during the electroforming process. The simulation results show that the uniformity of electroformed layer with micro/nano-cavities can be effectively improved with a better replication quality by using a lower initial current density. Both nano-diaphragm and nanopillar array are selected as masters for the electroforming experiments. When the initial current density decreases from 4A/dm2 to 1A/dm2, the maximum deviation of characteristic width between the nano-diaphragm master and mold inserts dramatically decreases from 60nm to ±20nm. By setting proper current density and enhancing mass transfer near the cathode surface, the characteristic diameter dimension error of electroformed mold inserts for nanopillar array decreases from 6.27% to 2.49%. The replication quality of electroformed mold inserts with micro/nano-cavities can be significantly improved by these methods. © 2017, Journal of Materials Engineering. All right reserved.
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页码：52 / 58
页数：6
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