3D quality information extraction technology for SMT solder joint of chip components

被引：0

作者：

Zhao, Hui-Huang ^{[1
]}

Zhou, De-Jian ^{[2
,3
]}

Huang, Chun-Yue ^{[3
]}

机构：

[1] School of Electronical and Mechanical Engineering, Xidian University, Xi'an 710071, China

[2] Department of Mechanical Engineering, Guangxi University of Technology, Liuzhou 545006, China

[3] School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China

来源：

Jisuanji Jicheng Zhizao Xitong/Computer Integrated Manufacturing Systems, CIMS | 2010年 / 16卷 / 08期

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引用

页码：1714 / 1719