Signal integrity;Practical EBG application to multilayer PCB: impact on power integrity

被引：16

作者：

De Paulis, F. ^{[1
]}

Nisanci, M.H. ^{[1
]}

Orlandi, A. ^{[2
]}

Fan, Jun ^{[2
]}

机构：

[1] University of L'Aquila, L'Aquila

来源：

IEEE Electromagnetic Compatibility Magazine | 2012年 / 1卷 / 03期

关键词：

Electromagnetic band-gap structures; Power integrity; Printed circuit boards;

D O I：

10.1109/MEMC.2012.6347053

中图分类号：

学科分类号：

摘要：

This work reviews the use of planar electromagnetic bandgap structures for power bus noise reduction in the GHz band. The key points for a quick and efficient design of planar EBG are also reviewed. A practical application example is offered that is able to combine a good reduction level of power bus noise, together to a limited impact for the interconnects referenced to the EBG patterned plane. This latter effect is investigated in details in a follow-up article. The case study focuses on the EBG laid out on an inner stack-up layer, to avoid loosing generality in the EBG implementation. The placement of the additional stitching vias required by the embedded EBG layout is investigated and discussed extensively. Simulation results are provided to validate the proposed EBG layout techniques. ©2012 IEEE Electromagnetic Compatibility Magazine.

引用

页码：60 / 65

页数：5

共 21 条

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