2D materials-based 3D integration for neuromorphic hardware

被引:11
作者
Kim, Seung Ju [1 ,2 ]
Lee, Hyeon-Ji [1 ]
Lee, Chul-Ho [3 ,4 ]
Jang, Ho Won [1 ,5 ]
机构
[1] Seoul Natl Univ, Res Inst Adv Mat, Dept Mat Sci & Engn, Seoul, South Korea
[2] Univ Southern Calif, Ming Hsieh Dept Elect & Comp Engn, Los Angeles, CA USA
[3] Seoul Natl Univ, Dept Elect & Comp Engn, Seoul, South Korea
[4] Seoul Natl Univ, Interuniv Semicond Res Ctr, Seoul, South Korea
[5] Seoul Natl Univ, Adv Inst Convergence Technol, Suwon, South Korea
基金
新加坡国家研究基金会;
关键词
DEPOSITION; MONOLAYER; GROWTH; SENSOR; ARRAY;
D O I
10.1038/s41699-024-00509-1
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Neuromorphic hardware enables energy-efficient computing, which is essential for a sustainable system. Recently, significant progress has been reported in neuromorphic hardware based on two-dimensional materials. However, traditional planar-integrated architectures still suffer from high energy consumption. This review systematically explores recent advances in the three-dimensional integration of two-dimensional material-based neuromorphic hardware to address these challenges. The materials, process, device physics, array, and integration levels are discussed, highlighting challenges and perspectives.
引用
收藏
页数:11
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