2D materials-based 3D integration for neuromorphic hardware

被引：11

作者：

Kim, Seung Ju ^{[1
,2
]}

Lee, Hyeon-Ji ^{[1
]}

Lee, Chul-Ho ^{[3
,4
]}

Jang, Ho Won ^{[1
,5
]}

机构：

[1] Seoul Natl Univ, Res Inst Adv Mat, Dept Mat Sci & Engn, Seoul, South Korea

[2] Univ Southern Calif, Ming Hsieh Dept Elect & Comp Engn, Los Angeles, CA USA

[3] Seoul Natl Univ, Dept Elect & Comp Engn, Seoul, South Korea

[4] Seoul Natl Univ, Interuniv Semicond Res Ctr, Seoul, South Korea

[5] Seoul Natl Univ, Adv Inst Convergence Technol, Suwon, South Korea

来源：

NPJ 2D MATERIALS AND APPLICATIONS | 2024年 / 8卷 / 01期

基金：

新加坡国家研究基金会;

关键词：

DEPOSITION; MONOLAYER; GROWTH; SENSOR; ARRAY;

D O I：

10.1038/s41699-024-00509-1

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Neuromorphic hardware enables energy-efficient computing, which is essential for a sustainable system. Recently, significant progress has been reported in neuromorphic hardware based on two-dimensional materials. However, traditional planar-integrated architectures still suffer from high energy consumption. This review systematically explores recent advances in the three-dimensional integration of two-dimensional material-based neuromorphic hardware to address these challenges. The materials, process, device physics, array, and integration levels are discussed, highlighting challenges and perspectives.

引用

页数：11

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