Study on Aluminum Nitride Microwave Attenuation Ceramics with High Thermal Conductivity

被引:0
|
作者
Zhang, Yongqing [1 ]
Yin, Shengyi [1 ]
Gao, Xiangyang [1 ]
Li, Xiuxia [1 ]
Jin, He [1 ]
Zhang, Lianzheng [1 ]
机构
[1] Key Laboratory of High Power Microwave Sources and Technologies, Institute of Electronics, Chinese Academy of Sciences, Beijing,101407, China
关键词
Aluminum nitride;
D O I
暂无
中图分类号
学科分类号
摘要
To solve the problems of high toxicity and poor consistency of traditional beryllium oxide microwave attenuation ceramics, a kind of AlN-FeSiAl microwave attenuation ceramic based on aluminum nitride with high thermal conductivity was developed. The material belongs to environment-friendly material by adding FeSiAl to the AlN matrix. In order to obtain high thermal conductivity and good electromagnetic performance, the effects of different aluminum nitride powders, FeSiAl additive amount and sintering process on composite properties were studied. The results show that when adopting Toyo aluminum nitride, adding 10 wt% FeSiAl, and vacuum hot pressing sintering under 1650℃ and 85 MPa, the high attenuation performance of microwave attenuation ceramics is realized, and material thermal conductivity is 88.2 W/m•K, close to that of the microwave attenuation ceramics based on aluminum nitride in Ceradyne company. © 2020, Science Press. All right reserved.
引用
收藏
页码:655 / 660
相关论文
共 50 条
  • [1] Study on Aluminum Nitride Microwave Attenuation Ceramics with High Thermal Conductivity
    Zhang Yongqing
    Yin Shengyi
    Gao Xiangyang
    Li Xiuxia
    Jin He
    Zhang Lianzheng
    RARE METAL MATERIALS AND ENGINEERING, 2020, 49 (02) : 655 - 660
  • [2] CHARACTERISTICS OF HIGH-THERMAL-CONDUCTIVITY ALUMINUM NITRIDE CERAMICS
    CHEN, CF
    PROCEEDINGS OF THE TECHNICAL CONFERENCE : NINTH ANNUAL INTERNATIONAL ELECTRONICS PACKAGING CONFERENCE, VOLS 1 AND 2, 1989, : 1291 - 1304
  • [3] Processing and Characterization of Aluminum Nitride Ceramics for High Thermal Conductivity
    Lee, Hyun Min
    Bharathi, Kamala
    Kim, Do Kyung
    ADVANCED ENGINEERING MATERIALS, 2014, 16 (06) : 655 - 669
  • [4] High thermal conductivity aluminum nitride for high power microwave windows - An update
    Savrun, Ender
    Nguyen, Vu
    2006 IEEE INTERNATIONAL VACUUM ELECTRONICS CONFERENCE HELD JOINTLY WITH 2006 IEEE INTERNATIONAL VACUUM ELECTRON SOURCES, 2006, : 35 - 35
  • [5] Study on the Preparation of Aluminum Nitride with High Thermal Conductivity
    Zhao Dongliang
    Gao Ling
    2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 493 - 495
  • [6] The effect of temperature on the thermal conductivity of aluminum nitride ceramics
    Wang, Li-Ying
    Li, Xiao-Lei
    Su, Tai-Chao
    Li, Shang-Sheng
    Li, Xiao-Hu
    Gongneng Cailiao/Journal of Functional Materials, 2012, 43 (04): : 450 - 453
  • [7] Research on high thermal conductivity and low loss tangent aluminum nitride ceramics
    Yang Yan-Ling
    Lu Yan-Ping
    2019 INTERNATIONAL VACUUM ELECTRONICS CONFERENCE (IVEC), 2019,
  • [8] DEVELOPMENT AND MICROSTRUCTURAL CHARACTERIZATION OF HIGH-THERMAL-CONDUCTIVITY ALUMINUM NITRIDE CERAMICS
    KUROKAWA, Y
    UTSUMI, K
    TAKAMIZAWA, H
    JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1988, 71 (07) : 588 - 594
  • [9] Effect of High Pressure Annealing on Microstructure and Thermal Conductivity of Aluminum Nitride Ceramics
    Li Xiao-Lei
    Li De-You
    Wang Li-Ying
    Li Shang-Sheng
    Su Tai-Chao
    Ma Hong-An
    Jia Xiao-Peng
    JOURNAL OF INORGANIC MATERIALS, 2010, 25 (05) : 537 - 540
  • [10] High Thermal Conductivity Silicon Nitride Ceramics
    Hirao, Kiyoshi
    Zhou, You
    Hyuga, Hideki
    Ohji, Tatsuki
    Kusano, Dai
    JOURNAL OF THE KOREAN CERAMIC SOCIETY, 2012, 49 (04) : 380 - 384