PCS power amplifier module package using selectively anodized aluminum substrate

被引：0

作者：

Shin, Seong-Ho ^{[1
]}

Lee, Ju-Hyang ^{[2
]}

Sohn, Bo-In ^{[1
]}

Ryu, Seung-Han ^{[1
]}

Kwon, Young-Se ^{[1
]}

机构：

[1] Dept. of EECS, KAIST, 373-1 Guseong-dong, Yuseong-gu, Daejeon, 305-701, Korea, Republic of

[2] Telecommunication Network Business, Samsung Electronics Co., LTD., Suwon, Kyungki-do, Korea, Republic of

来源：

Proc. Eur. Microwave Conf. EuMC | / 1767-1770期

关键词：

Compendex;

D O I：

4058194

中图分类号：

学科分类号：

摘要：

Aluminum - Electric inductors - Electronics packaging - Heat losses - Monolithic microwave integrated circuits - Voltage control

引用