Molecular dynamics analysis on elementary process of coating by high-temperature and high-speed droplet (flattening process and atomic behavior of droplet)

被引:0
作者
Shimizu, Jun [1 ]
Ohmura, Etsuji [1 ]
Kobayashi, Yoshifumi [1 ]
Kiyoshima, Shoichi [1 ]
Eda, Hiroshi [1 ]
机构
[1] Department of Systems Engineering, Faculty of Engineering, Ibaraki University, Hitachi-shi, Ibaraki, 316-8511
来源
Nihon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C | 2005年 / 71卷 / 01期
关键词
Coating; Computer Simulation; Droplet; Flattening; Molecular Dynamics; Pulsed Laser Deposition; Solidification; Substrate; Thermal Spraying;
D O I
10.1299/kikaic.71.298
中图分类号
学科分类号
摘要
In order to clarify the flattening process of the high-temperature and high-speed droplet due to its impact on the substrate in an atomic level, a three-dimensional molecular dynamics simulation was conducted. The droplet and the substrate were assumed to consist of pure aluminum, and Morse potential was postulated between a pair of aluminum atoms. By visualizing the analytical result, the processes of melting and solidification, temperature distribution, deformation velocity and potential energy of atoms of the droplet were clarified. As a result, following conclusions were obtained: (1) The transfer of the droplet atoms to the horizontal direction in flattening process increases in proportion to the horizontal distance from the central axis of the droplet. (2) The solidification of the droplet starts from the outside edge of the droplet, and finishes as the flattening ratio increases.
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页码:298 / 303
页数:5
相关论文
共 11 条
[1]  
Chrisey D.B., Hubler G.K., Pulsed Laser Deposition of Thin Films, (1994)
[2]  
Merkulov V.I., Lowndes D.H., Jellison Jr. G.E., Puretzky A.A., Geohegan D.B., Appl. Phys. Lett., 73, (1998)
[3]  
Madejski J., Int. J. Heat Mass Transfer, 19, (1976)
[4]  
Delplanque J.P., Rangel R.H., J. Mat. Sci., 32, (1997)
[5]  
Pasandideh-Fard M., Qiao Y.M., Chandra S., Mostaghimi J., Phys. Fluids, 8, 3, (1996)
[6]  
Pasandideh-Fard M., Bhola R., Chandra S., Mostaghimi J., Int J. Heat Mass Transfer, 41, (1998)
[7]  
Hukunuma H., Ohmori A., Proc. 7th NTSC, (1994)
[8]  
Jones H., J. Phys. D, Appl. Phys., 4, (1971)
[9]  
Trapaga G., Szekely J., Metall. Trans., 22 B, (1991)
[10]  
Trapaga G., Szekely J., Metall. Trans., 23 B, (1992)