Microstructure of Au-Sn eutectic bumps prepared by sequential electroplating

被引：0
|
作者：
Pan, Jian-Ling [1 ,2 ]
Huang, Ming-Liang [1 ,2 ]
Zhao, Ning [1 ,2 ]
机构：
[1] School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
[2] Key Laboratory of Liaoning Advanced Welding and Joining Technology, Dalian University of Technology, Dalian 116024, China
来源：
Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals | 2012年 / 22卷 / 07期
关键词：
Compendex;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Binary alloys
引用
收藏
页码：2016 / 2022
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