Copper interconnections and antennas fabricated by hot-pressing printed copper formate

被引：7

作者：

Rosen Y.S. ^{[1
]}

Lidor Y. ^{[2
]}

Baiter R. ^{[3
]}

Szeskin A. ^{[1
]}

Awadallah A. ^{[1
]}

Shacham-Diamand Y. ^{[2
]}

Magdassi S. ^{[1
]}

机构：

[1] Hebrew University of Jerusalem, Casali Center of Applied Chemistry, Institute of Chemistry, Jerusalem

[2] Department of Physical Electronics (EE), Dept. of Materials Science and Engineering, Faculty of Engineering, Tel Aviv University, Tel Aviv

来源：

Flex. Print. Electron. | / 3卷

基金：

新加坡国家研究基金会;

关键词：

Copper formate; Copper ink; Copper precursor; Hot-press; Printed antennas; Printed electronics;

D O I：

10.1088/2058-8585/aa89bb

中图分类号：

TG [金属学与金属工艺]; TH [机械、仪表工业];

学科分类号：

0802 ; 0805 ;

摘要：

We present a novel process to fabricate conductive patterns by a new copper precursor ink. In this method, an ink with copper formate, a self-reducible copper precursor, is printed, and subsequently heated under high pressure in a hot-press, which is commonly used in the printed circuit board industry. The heating leads to decomposition of the precursor, and results in copper patterns with good electrical conductivity. The application of pressure enables the formation of a dense copper film. 5-15 μm thick copper patterns were obtained on FR4 sheets with an equivalent specific resistivity as low as 5.3 ± 0.3 cm, which is about three times the copper bulk resistivity. Unlike most methods for copper precursor inks, this ink and process do not require an inert environment, and can be performed with instrumentation already used in the industry. Finally, we demonstrate the applicability of this method by printing functional radio frequency components; i.e. antennas for near field communication and Wi-Fi. © 2017 IOP Publishing Ltd.

引用

共 30 条

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