The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering

被引：0

作者：

Ramli, M.I.I. ^{[1
]}

Mohd Salleh, M.A.A. ^{[1
]}

Yasuda, H. ^{[2
]}

Chaiprapa, J. ^{[3
]}

Nogita, K. ^{[4
]}

机构：

[1] Center of Excellence Geopolymer & Green Technology (CeGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, Jejawi, Arau,Perlis,02600, Malaysia

[2] Department of Materials Science and Engineering, Kyoto University, Sakyo-ku, Kyoto,606-8501, Japan

[3] Synchrotron Light Research Institute, Muang, Nakhon Rathasima,3000, Thailand

[4] Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland, Brisbane,QLD,4072, Australia

来源：

Materials and Design | 2021年 / 186卷

关键词：

Microstructure;

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摘要：

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