Examining the contribution of tamping effect on inter-splat bonding during cold spray

被引：0

作者：

Vinay, Gidla ^{[1
]}

Halder, Shrabanti ^{[1
]}

Kant, Ravi ^{[1
]}

Singh, Harpreet ^{[1
]}

机构：

[1] Department of Mechanical Engineering, Indian Institute of Technology Ropar, Rupnagar,140001, India

来源：

Materials Science and Engineering: A | 2024年 / 893卷

关键词：

3D printing - Additives - Corrosion resistance - Deposits - Energy transfer - Tensile testing;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

In Cold Spray Additive Manufacturing (CSAM), the 'tamping effect'—resulting from continuous impact of incoming particles enhances the mechanical properties of deposited layers. While the impact of tamping on porosity is well-studied, its influence on inter-splat bonding remains unexplored. In this study a multiparticle simulation based on Finite Element Analysis (FEA) is employed, featuring 120 particles distributed across 12 layers to model the deposition process in cold spray. A methodology is developed to discern the effect of tamping, enabling the estimation of particle boundary temperatures under conditions with and without tamping. Energy analysis and inter-splat boundary temperature variations obtained from simulations are examined to understand the contribution of tamping to bonding. Our findings reveal a significant increase in inter-splat boundary temperatures, attributed to energy transfer from overlying layers, positively impacting bonding. The proposed hypothesis is substantiated through mechanical testing and the assessment of inter-splat bonding-related properties, including hardness, tensile strength, scratch resistance, and corrosion resistance, as a function of deposit thickness. CSAM IN718 and Cu deposits with a thickness of 4 mm are used as subjects for this study. © 2024 Elsevier B.V.

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