PWM converter power density barriers

被引：34

作者：

ETH Zurich, Power Electronic Systems Laboratory, Physikstrasse 3, 8092 Zurich, Switzerland ^{[1
]}

不详 ^{[2
]}

机构：

[1] ETH Zurich, Power Electronic Systems Laboratory, 8092 Zurich

[2] Vienna University of Technology

来源：

IEEJ Trans. Ind Appl. | 2008年 / 4卷 / 468-480+15期

关键词：

Cooling system; Figures of merit; Passive components; Power density;

D O I：

10.1541/ieejias.128.468

中图分类号：

学科分类号：

摘要：

Power density of power electronic converters has roughly doubled every 10 years since 1970. Behind this trajectory is the continuous advancement of power semiconductor devices, which has increased the converter switching frequencies by a factor of 10 every decade. However, today's cooling concepts and passive components are major barriers for a continuation of this trend. To identify such technological barriers, this paper investigates the volume of the cooling system and passive components as a function of the switching frequency for power electronic converters and determines the switching frequency that minimizes the total volume. A power density limit of 28 kW/dm3 at 300 kHz is calculated for an isolated DC-DC converter, 44 kW/dm3 at 820 kHz for a three-phase unity power factor PWM rectifier, and 26kW/dm3 at 21 kHz for a sparse matrix converter. For single-phase AC-DC conversion a general limit of 35 kW/dm3 results from the DC link capacitor. These power density limits highlight, the need to broaden the scope of power electronics research to include cooling systems, high frequency electromagnetics, interconnection and packaging technology, and multi-domain modelling and simulation to ensure further advancement along the power density trajectory. © 2008 The Institute of Electrical Engineers of Japan.

引用

页码：468 / 480+15

共 55 条

[1]

Calwell C., Mansoor A., AC-DC server power supplies: Making the leap to higher efficiency, Proc. of Applied Power Electronics Conf. (APEC'05), 1, pp. 155-158, (2003)

[2]

Jain P.K., Power electronics for low voltage semiconductor technology: Challenges and some possible solutions, Proc. of Power Electronics and Motion Control Conf. (IPEMC04), pp. 20-28, (2004)

[3]

Yotsumoto K., Ohashi Y., Kuwata Y., Development of an efficient, lightweight switched-mode power supply for telecommunications network use, Proc. of IEEE Int. Telecommunications Energy Conf. (INT-ELEC'86), pp. 25-30, (1910)

[4]

Mathuna S.C.O., O'Donnell T., Wang N., Rinne K., Magnetics on silicon: An enabling technology for power supply on chip, IEEE Trans. on Power Electronics, 20, 3, pp. 585-592, (2005)

[5]

Maerz M., Poech M.H., Schimanek E., Schletz A., Mechatronic integration into the hybrid powertrain-the thermal challenge, Proc. Int. Conf. Automotive Power Electronics (APE), pp. 1-6, (2006)

[6]

Homeyer W.G., Bowles E.E., Lupan S.P., Walia P.S., Maldonado M.A., Advanced power converters for more electric aircraft applications, Energy Conversion Engineering Conf. (IECEC'97), pp. 591-596, (1997)

[7]

Electrical & Electronics Technical Team Roadmap, (2006)

[8]

Mullett C.E., A 5-year power technology roadmap, Proc. Applied Power Electronics Conf. (APEC'04), pp. 11-17, (2004)

[9]

Ohashi H., Recent power devices trend, Trans. of IEEJ, 12, 3, pp. 168-171, (2002)

[10]

Ohashi H., Research activities of the power electronics research centre with special focus on wide band gap materials, Proc. of 4th Int. Conf. on Integrated Power Systems, pp. 153-156, (2006)

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