Molecular dynamics simulation of interface bonding and tensile properties of Cu/Al casting

被引：0
|
作者：
Qian X.-F. [1 ]
Guo Q.-N. [1 ]
Yang S.-E. [1 ]
Wang M.-X. [1 ]
Liu Q. [1 ]
Wang J.-F. [1 ]
机构：
[1] School of Physics, Zhengzhou University, Zhengzhou
来源：
Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals | 2020年 / 30卷 / 12期
基金：
中国国家自然科学基金;
关键词：
Casting; Cu/Al multilayer film; Interface diffusion; Molecular dynamics;
D O I：
10.11817/j.ysxb.1004.0609.2020-37681
中图分类号：
学科分类号：
摘要：
The effects of different casting temperature and casting time on the interfacial diffusion of Cu/Al multilayer films were studied based on the molecular dynamics method. The tensile deformation of Cu/Al multilayer films under different casting time and casting temperature was compared from the aspects of mechanical properties and dislocation slip, and the effects of microatomic structure and the mechanical properties of metal films were revealed. The results show that the thickness of transition layer and the number of Cu and Al atoms diffusing each other near the interface both increase with the increase of casting temperature and casting time. The yield strength and tensile strength of Cu/Al multilayer films also increase at first and then decrease with the increase of casting temperature and casting time. When the casting temperature is 1013 K and the casting time is 0.2 ns, the mechanical properties of Cu/Al multilayers are the best. © 2020, Science Press. All right reserved.
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页码：2886 / 2900
页数：14
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