Reliability of the Pb-free solder bump on electroless Ni under bump metallurgies

被引：0
作者：
Kim, N.S. [1 ]
Jung, S.Y. [1 ]
Oh, S.Y. [1 ]
机构：
[1] Interconnect Prod. and Technol. Team, Memory Div. Device Solution Network, Samsung Electronics Co. Ltd., San# 24, Nongseo-Ri, Giheung-Eup, Yongin-City, Gyeonggi-Do, Korea, Republic of
来源：
Proc Electron Compon Technol Conf | 1600年 / 77-82期
关键词：
Compendex;
D O I：
53rd Electronic Components and Technology Conference 2003
中图分类号：
学科分类号：
摘要：
Electronics packaging - Flip chip devices - Microelectronic processing - Pressure effects - Soldering - Thermal effects
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