Thermal analysis for LED chip on board package based on plastic radiator without substrate

被引：0

作者：

机构：

[1] School of Materials Science and Engineering, South China University of Technology, Guangzhou

[2] State Key Laboratory of Luminescent Materials and Devices, South China University of Technology, Guangzhou

[3] College of Automation Science and Engineering, South China University of Technology, Guangzhou

来源：

Wu, Y. (xyuwu@scut.edu.cn) | 1600年 / Chinese Optical Society卷 / 33期

关键词：

Chip onboard package; Finite element analysis; Optoelectronics; Plastic radiator; Thermal analysis;

D O I：

10.3788/AOS201333.0823005

中图分类号：

学科分类号：

摘要：

A novel method of LED chip on board (COB) package based on plastic radiator without substrate is proposed. The thermal properties of tradition COB package and this new structure are simulated by using finite element analysis software Ansys. The simulation results show that, by mounting the LED chips on the plastic radiator with thermal conductivity of 20 W/(m·K), the method of LED COB package can provide a much lower temperature than the metal substrate COB package, and is similar to the ceramic substrate COB package. By further simulations, it is found that the thermal resistance is the minimum when the thickness of the plastic radiator is 3.9 mm. Moreover, with the thermal conductivity and the convection coefficient increasing, the thermal resistance reduces in different degrees. Because of the easy preparation process and colorful luster of the plastic, this new method of LED COB package has a broad application prospect.

引用

共 8 条

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