Experimental investigation on cutting aluminum alloy thick plate with brazed diamond wire saw

被引：0

作者：

Xiao, B. ^{[1
]}

Li, S.S. ^{[1
,2
]}

Zhang, F.L. ^{[1
]}

Wang, B. ^{[1
]}

Li, S. ^{[1
]}

机构：

[1] College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics

[2] Department of Mechanical and Electrical Engineering, Taizhou Polytechnic Institute, Taizhou

来源：

Xiao, B. (xbxiao@263.net) | 1600年 / Trans Tech Publications, P.O. Box 1254, Clausthal-Zellerfeld, D-38670, Germany卷 / 426期

关键词：

Aluminum Alloy Thick Plate; Brazed; Cutting; Diamond; Wire Saw;

D O I：

10.4028/www.scientific.net/AMR.426.218

中图分类号：

学科分类号：

摘要：

A new high frequency induction brazed monolayer diamond wire saw for cutting aluminum alloy thick plate is developed with the helical continuous cutting edge distance on the wire surface. In order to solve the problems of forming cutting aluminum alloy plates,the brazed diamond wire saw is used to conduct the preliminary cutting tests on the 50 mm aluminum alloy plates on the modified grinder experimental platform.The results indicate that the cutting efficiency of the brazed diamond wire saw is increased with the increasing of the feed tension, the wire saw line speed and the diamond grits size. Furthermore, some cutting chips shape of the aluminum alloy is presented based on experimental cutting. © (2012) Trans Tech Publications, Switzerland.

引用

页码：218 / 222

页数：4

共 6 条

[1] Lin G.Y., Undamental Research Related to the Fabrication Technology for High Quality Thick Plates of 7×75 Series Aluminum Alloys, (2006)
[2] Staley J.T., Liu J., Hunt Wh.J., Advanced Materials & Processes, 10, (1997)
[3] Tonshoff H.K., Hill H., Diamond and Related Materials, 11, (2002)
[4] Sung C.M., Diamond and Related Materials, 8, (1999)
[5] Xu H.J., Fu Y.C., Xiao B., Xu J.H., Key Eng. Mater., 259-260, (2004)
[6] Malkin S., Grinding Technology: Theory and Application of Machining with Abrasives, (1989)

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