Influence of Silica-core Structure on Polishing Characteristics of Core/shell Structured Composite Particles of SiO2/CeO2

被引：0

作者：

Chen A. ^{[1
]}

Li Z. ^{[2
]}

Chen Y. ^{[2
]}

机构：

[1] School of Mechanical Engineering, Changzhou University, Changzhou, 213164, Jiangsu

[2] School of Materials Science and Engineering, Changzhou University, Changzhou, 213164, Jiangsu

来源：

Cailiao Yanjiu Xuebao/Chinese Journal of Materials Research | 2017年 / 31卷 / 06期

基金：

中国国家自然科学基金;

关键词：

Ceria; Composite particle; Core-shell structure; Inorganic non-metallic material; Polishing; Silica;

D O I：

10.11901/1005.3093.2016.625

中图分类号：

学科分类号：

摘要：

The composite particles of mSiO2/CeO2(330-340 nm in size) were prepared by applying CeO2 nanoparticles coating (15-20nmin thickness) on core material of mesoporous silica (mSiO2, ca.300 nm in size) with radial mesochannels (ca.2.6 nm in pore size). The prepared composite particles were characterized by transmission electron microscopy, field emission scanning electron microscopy, X-ray diffraction, Fourier transform infrared spectroscopy, and nitrogen adsorption-desorption analysis. The results show that the oxidized silicon wafer substrates was polished comparatively with when taking mSiO2/CeO2 composite particles or sSiO2/CeO2 composite particles (solid silica core) as polishing paste, the polished pre-oxidized silicon wafer presented had a lower root-mean-square roughness (RMS=0.267 nm) and a higher material removal rate(MRR=45 nm/min) for the former paste, in the contrast, than those of the sSiO2/CeO2 composite particles with solid silica cores (RMS=0.309 nm and MRR=24 nm/min for the later one. Furthermore, the mSiO2/CeO2 composite particles may be beneficial were attributed to the elimination of mechanical damages (such as scratches) on the wafer surface. The very structure of silica core of mSiO2/CeO2 composite particles presented obvious effects for their polishing characteristics. © All right reserved.

引用

页码：429 / 436

页数：7

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