Microstructure of amorphous copper-carbon thin films formed by plasma-enhanced chemical vapor deposition

被引:0
作者
Astashynskaya M.V. [1 ]
Astashynski V.V. [1 ]
Kvasov N.T. [1 ]
Uglov V.V. [2 ]
机构
[1] Research Laboratory, Department of Solid State Physics, Belarusian State University, 4 Nezavisimost Ave., Minsk
[2] Tomsk Polytechnic University, 2a Lenin Ave., Tomsk
来源
High Temperature Material Processes | 2016年 / 20卷 / 02期
基金
俄罗斯科学基金会;
关键词
Cu/a–C:H composite thin films; Microstructure; Nanoclusters; Plasmaenhanced chemical vapor deposition;
D O I
10.1615/HighTempMatProc.2016017797
中图分类号
学科分类号
摘要
The microstructure of copper-carbon Cu/a–C:H nanocomposites formed by plasma-enhanced chemical vapor deposition has been determined by transmission electron microscopy. The formation of spherical copper inclusions embedded in the matrix of amorphous carbon was observed. The average size of the copper inclusions decreases from 16 to 5 nm on increasing the carbon concentration from 8 to 75 at.%. A description of the copper clusters formation processes in the reactor chamber was proposed. The results of calculation of the average size of copper clusters are in good agreement with the observed size of the copper inclusions formed in nanocomposite thin films. © 2016 by Begell House, Inc.
引用
收藏
页码:115 / 126
页数:11
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