Integration adds new dimension to packaging

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Microwave Engineering Europe | 2003年 / JAN/FEB期
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Analog to digital conversion - Embedded systems - Microelectromechanical devices - Monolithic microwave integrated circuits - Packaging - Waveguides - Wireless telecommunication systems;
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摘要：
The collective wiring technology, used for integrating passive components is discussed. The approach utilised LTCC substrates, which included multi-layer embedded high pass filters and stacked cavity-backed patch antennas. The high Q-factor inductors and embedded filters were integrated into organic substrates. Multi-stepped cavities provided the means of embedding active devices and also MEMS devices.
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页码：13 / 14
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