Development of lead-free solders in China during the past decade

被引：0
作者：
Zhang L. [1 ]
Tu K. [2 ]
Chen S. [3 ]
Fan H. [1 ]
Lu X. [1 ]
Hu X. [4 ]
Zhong S. [5 ]
Yang F. [1 ]
机构：
[1] School of Mechanical & Electrical Engineering, Jiangsu Normal University, Xuzhou
[2] Department of Materials Science and Engineering, University of California, Los Angeles, 90095, CA
[3] Department of Chemical Engineering, National Tsing Hua University, Hsinchu
[4] School of Mechanical & Electrical Engineering, Nanchang University, Nanchang
[5] State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou
来源：
Zhongguo Kexue Jishu Kexue/Scientia Sinica Technologica | 2016年 / 46卷 / 08期
关键词：
Alloying; Lead-free solder; Nanominiaturization; Particle strength; Reliability;
D O I：
10.1360/N092015-00212
中图分类号：
学科分类号：
摘要：
For the new lead-free solders research in China during the past decade, the research status and development trend of lead-free solders were reviewed synthetically. First of all, it is imperative to discuss the behaviors of different lead-free solder, and the effect of alloying, particles strength and nanominiaturization on lead-free solders. Secondly, the fluxes for lead-free solders were also reviewed and the research development of new flux was discussed. Thirdly, the applications of lead-free solders in electronic industry were remarked, and the related reliability issues were discussed. Lastly the future progress of lead-free solders was prospected, the issues of the lead-free solders were analyzed and some measures were shown for solving these problems, which can provide the theoretical reference for the lead-free solders. © 2016 Chin J Biotech, All right reserved.
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页码：767 / 790
页数：23
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