Microstructures and properties of SnAgCu solder doped with Eu

被引：0
|
作者：
Zhang, Liang [1 ,2 ,3 ]
Tu, King Ning [3 ]
Guo, Yonghuan [1 ]
He, Chengwen [1 ]
机构：
[1] Mechanical and Electrical Engineering Institute, Jiangsu Normal University, Xuzhou,221116, China
[2] Provincial Key Laboratory of Advanced Welding, Jiangsu University of Science and Technology, Zhenjiang,212003, China
[3] Department of Materials Science and Engineering, University of California, Los Angeles,CA90024, United States
来源：
Xiyou Jinshu/Chinese Journal of Rare Metals | 2015年 / 39卷 / 01期
关键词：
Isothermal aging - Matrix microstructure - Microstructures and properties - Oxidation mechanisms - Sn whisker - Solder microstructure - Tensile forces - Whisker growth;
D O I：
10.13373/j.cnki.cjrm.2015.01.002
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：11 / 15
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