共 50 条
- [1] Best practices in automated underfill dispensing 2ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS, 1998, : 63 - 68
- [2] An optimization study of underfill dispensing volume IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2003, 26 (03): : 205 - 210
- [3] Best practices in automated underfill dispensing Proc Electron Packag Technol Conf EPTC, (63-68):
- [4] In-situ Observation of Underfill Dispensing Process 2023 International Conference on Electronics Packaging, ICEP 2023, 2023, : 57 - 58
- [6] Dispensing flip chip underfill process problems and solutions 3RD INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING 1998, PROCEEDINGS, 1998, : 178 - 183
- [7] Study of underfill dispensing for a large-die package 2017 IEEE 19TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2017,
- [8] Dispensing flip chip underfill process problems and solutions TWENTY SECOND IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, IEMT-EUROPE 1998: ELECTRONICS MANUFACTURING AND DEVELOPMENT FOR AUTOMOTIVES, 1998, : 119 - 124
- [9] Evolution of Corporate Reporting and Emerging Trends JOURNAL OF CORPORATE ACCOUNTING AND FINANCE, 2016, 27 (04): : 27 - 30
- [10] Application of the Underfill Model to Bump Arrangement and Dispensing Process Design IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2010, 33 (02): : 122 - 128