Packaging goes pop

The ability of popcorn to swell when heated is the principle behind a new range of packaging materials aimed at the electronic goods field to replace polystyrene chips and sheeting. Popnat, founded by Luc de Moustier in France in 2000 has filed patents in many countries relating to the technology and process. In partnership with Ahlstrom Corporation, a Popnat product which has been developed comprises the corn sandwiched between two layers of viscose and cellulose nonwoven coated in a thin polyethylene film (under 10% of the overall weight). The manufacturing method is explained and a pilot plant has been established at Agen. Co-operation is now sought with a machine builder to commercialise the process. The savings in space and transportation are described. An important environmental consideration is that within 45 days 85% of the discarded material will have fully composted. Other advantages are also listed and raw material details are included.