Exploring the vulnerability of CMPs to soft errors with 3d stacked non-volatile memory

被引:0
作者
Sun, Guangyu [1 ]
机构
[1] Peking University, 515N Science Building, Haidian District, Beijing 100871
来源
Lecture Notes in Electrical Engineering | 2014年 / 267卷
关键词
Three dimensional integrated circuits - Radiation hardening;
D O I
10.1007/978-3-319-00681-9_4
中图分类号
学科分类号
摘要
Due to the continuously reduced feature size, supply voltage, and increased on-chip density, modern microprocessors are projected to be more susceptible to soft error strikes. © 2014 Springer International Publishing Switzerland.
引用
收藏
页码:93 / 117
页数:24
相关论文
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