The move to lead-free manufacturing

被引：0

作者：

Higgins III, Leo M. ^{[1
]}

机构：

[1] SDAATC, Austin, TX, United States

来源：

Printed Circuit Design | 2002年 / 19卷 / 12期

关键词：

Costs - Electroplating - Lead - Oxidation resistance - Product development - Soldering - Toxic materials - Wetting;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

The lead-free product development in electronics manufacturing was discussed. It was suggested that lead free materials must provide good wetting and solderability without the use of overly aggressive fluxes. It was also suggested that the lead free materials must not cause excessive cost increases or use the materials that carry their own environmental toxicity.

引用

页码：20 / 22