Evaluation and characterization of reliable non-hermetic conformal coatings for microelectromechanical system (MEMS) device encapsulation

被引：24

作者：

机构：

[1] [1,Wu, Jiali

[2] Pike, Randy T.

[3] 1,Wong, C.P.

[4] Kim, Namsoo P.

[5] Tanielian, Minas H.

来源：

Wu, Jiali | 2000年 / IEEE, Piscataway, NJ, United States卷 / 23期

关键词：

Number:; -; Acronym:; DARPA; Sponsor: Defense Advanced Research Projects Agency;

D O I：

10.1109/6040.883764

中图分类号：

学科分类号：

摘要：

引用