Practicalities of lead-free assembly

被引：0

作者：

Lea, Colin ^{[1
]}

机构：

[1] Department of Materials Centre, National Physical Laboratory, United Kingdom

来源：

Global SMT and Packaging | 2003年 / 3卷 / 04期

关键词：

Cleaning - Electronics engineering - Flame retardants - Laminates - Lead - Mathematical models - Optimization - Process engineering - Soldered joints - Soldering alloys - Throughput;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

The implementation of lead-free soldering process is discussed. The test methods for evaluating reliability of lead-free solder joints are developed and used to obtain better reliability of things such as pcb materials, component termination finishes and mixers of solders during rework. The test methods and data allow informed choice of materials and process parameters for improved performance of soldered assemblies. The theoretical and empirical models are also developed for predicting solder joint lifetime and failure modes.

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