Developing copper solutions for high-speed communications

被引：0
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作者：
Hynd, Douglas [1 ]
机构：
[1] Northrop Grumman, Winchester Electronics, Watertown, CT, United States
来源：
Electronic Products (Garden City, New York) | 2002年 / 45卷 / 05期
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摘要：
Until cost-effective optical interconnects arrive, copper bandwidths must improve.
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