Solder joint defects of PBGAs after lead-free assembly

被引：0

作者：

Ganesan, Sanka ^{[1
]}

Kim, Geunwoo ^{[1
]}

Wu, Ji ^{[1
]}

Pecht, Michael ^{[1
]}

Lee, Ricky ^{[2
]}

Lo, Jeffery ^{[2
]}

Fu, Yun ^{[3
]}

Li, Yonghong ^{[3
]}

Xu, Ming ^{[3
]}

Felba, Jan ^{[4
]}

机构：

[1] CALCE Electronic Products and Systems Center, University of Maryland, College Park,MD,20742, United States

[2] Hong Kong University of Science and Technology, Hong Kong

[3] Aero Combined Environment Laboratory China Aero-Polytechnology Establishment, Beijing,100028, China

[4] Wroclaw University of Technology, Wroclaw, Poland

来源：

Eur. Microelectron. Packag. Conf. Exhib., EMPC - Conf. Program. Proc. | / 63-68期

关键词：

Compendex;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Ball grid arrays - Binary alloys - Timing circuits - Copper alloys - Tin - Silver alloys - Soldered joints - Electronics packaging - Tin alloys - Copper - Lead alloys - Lead-free solders - Ternary alloys - Silver - Soldering - Surface mount technology

引用