Effect of Sb Addition on Electromigration in Solder Joints

被引：0

作者：

Yamanaka K. ^{[1
]}

Kondo N. ^{[1
]}

Mizutori H. ^{[1
]}

机构：

[1] Department of Electrical and Electronic Engineering, School of Engineering, Chukyo University, 101-2 Yagoto Honmachi, Showa, Nagoya, Aichi

来源：

Journal of Japan Institute of Electronics Packaging | 2021年 / 24卷 / 06期

关键词：

Electromigration; Mobility; Power Electronics; Reliability; Solder Joint;

D O I：

10.5104/jiep.JIEP-D-21-00019

中图分类号：

O441.1 [电学]; TM12 [];

学科分类号：

摘要：

Solder electromigration (EM) is recognized as a potential reliability problem in power modules and high performance processors. Power modules are getting smaller in size and higher in power, which causes the solder joints inside to operate at higher temperatures with higher current densities. The addition of Sb to a Sn-rich solder is known to be an effective way to allow high temperature operation up to 175°C. This study investigates the fundamental EM phenomena of a Cu/Ni-P/Sn-0.7Cu/Ni-P/Cu joint and a Cu/ Ni-P/Sn-5Sb-0.7Cu/Ni-P/Cu joint to understand the effect of Sb addition on EM under the condition of 175°C and 50 A/mm2. The EM failure occurred at the cathode after disappearance of the initial intermetallic compound (IMC) layer in both cases. The Sb addition can delay the decrease in thickness of the IMC layer; therefore it has the effect of extending the EM lifetime. © 2021 Japan Institute of Electronics Packaging. All rights reserved.

引用

页码：606 / 613

页数：7

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