Development of high frequency type MEMS ultrasonic array sensor using P(VDF/TrFE) thin films

被引：0
|
作者：
Tanaka T. [1 ]
Member S.M. [1 ]
Member M.U. [1 ]
机构：
[1] Osaka Research Institute of Industrial Science and Technology, 2-7-1, Ayumino, Izumi, 594-1157, Osaka
来源：
IEEJ Transactions on Sensors and Micromachines | 2019年 / 139卷 / 05期
关键词：
Diagram; MEMS; P(VDF/TrFE); Resonant frequency; Thin film; Ultrasonic sensor;
D O I：
10.1541/ieejsmas.139.88
中图分类号：
学科分类号：
摘要：
MEMS (microelectromechanical systems) ultrasonic array sensors were fabricated using the poly (vinylidene fluoride-trifluoroethylene) [P(VDF/TrFE)] copolymer thin films having multilayer diaphragm structures. For increased a resonant frequency of sensor, we developed a new diaphragm structure. The resonant frequency and sensitivity of new MEMS ultrasonic array sensor was estimated to be on the order of 376 kHz and −75 dBV (1V/Pa=0dBV), respectively. This MEMS ultrasonic array sensor can be adapted for ultrasonic 3D imaging and non-destructive ultrasonic testing systems. © 2019 The Institute of Electrical Engineers of Japan.
引用
收藏
页码：88 / 94
页数：6
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