Nanocomposite SAC solders: the effect of heat treatment on the morphology of Sn–3.0Ag–0.5Cu/Cu solder joints reinforced with Ni and Ni–Sn nanoparticles

被引：0

作者：

Yakymovych, Andriy ^{[1
,2
]}

Plevachuk, Yuriy ^{[3
]}

Orovcik, Lubomir ^{[4
]}

Švec Sr, Peter ^{[5
]}

机构：

[1] Dr. Oswin-Moro-Srt. 19, Villach,9500, Austria

[2] Department of Inorganic Chemistry-Functional Materials, Faculty of Chemistry, University of Vienna, Althanstr. 14, Vienna,1090, Austria

[3] Department of Metal Physics, Ivan Franko National University of Lviv, Kyrylo and Mefodiy St. 8, Lviv,79005, Ukraine

[4] Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Dubravska cesta 9, Bratislava,84513, Slovakia

[5] Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, Bratislava,84511, Slovakia

来源：

Applied Nanoscience (Switzerland) | 2022年 / 12卷 / 04期

关键词：

Intermetallics - Copper alloys - Lead-free solders - Morphology - Nickel - Growth kinetics - Tin alloys - Nanocomposites - Binary alloys;

D O I：

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学科分类号：

摘要：

引用

页码：977 / 982