IEEE Transactions on advanced packaging: Editorial

被引:0
|
作者
Krusius, J.P. [1 ]
机构
[1] Cornell University, Ithaca, NY 14853-1503, United States
来源
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:117 / 118
相关论文
共 50 条
  • [1] IEEE Transactions on Advanced Packaging
    Subbarayan, G
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2002, 25 (03): : 327 - 327
  • [2] Ieee Transactions on Advanced Packaging - Foreword
    Nakhla, M
    Canavero, F
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2002, 25 (03): : 328 - 328
  • [3] IEEE Transactions on Advanced Packaging: Foreword
    Caggiano, M.F.
    IEEE Transactions on Advanced Packaging, 2001, 24 (02):
  • [4] IEEE Transactions on Components and Packaging Technologies: Editorial
    Pecht, Michael G.
    Dieter, George
    IEEE Transactions on Components and Packaging Technologies, 2010, 33 (02):
  • [5] IEEE Transactions on Electronics Packaging Manufacturing: Editorial
    Trybula, Walter J.
    IEEE Transactions on Electronics Packaging Manufacturing, 2002, 25 (01):
  • [6] IEEE Transactions on Electronics Packaging Manufacturing: Editorial
    Trybula, Walter J.
    IEEE Transactions on Electronics Packaging Manufacturing, 2001, 24 (04): : 237 - 238
  • [7] IEEE Transactions on Components and Packaging Technologies: Editorial
    Pecht, Michael G.
    IEEE Transactions on Components and Packaging Technologies, 2002, 25 (02):
  • [8] IEEE Transactions on Components and Packaging Technologies: Editorial
    Pecht, Michael G.
    IEEE Transactions on Components and Packaging Technologies, 2002, 25 (03):
  • [9] IEEE Transactions on Components and Packaging Technologies: Editorial
    Pecht, Michael G.
    IEEE Transactions on Components and Packaging Technologies, 2002, 25 (04):
  • [10] IEEE Transactions on Nanotechnology: Editorial
    Requicha, Ari
    IEEE Transactions on Nanotechnology, 2007, 6 (06)