Subcooled boiling in a liquid chamber for high heat flux cooling

被引：0
|
作者：
Murabe, Kodai [1 ]
Unno, Noriyuki [1 ]
Yuki, Kazuhisa [1 ]
Suzuki, Koichi [1 ]
机构：
[1] Sanyo-Onoda City University, Yamaguchi,7560884, Japan
来源：
2022 International Conference on Electronics Packaging, ICEP 2022 | 2022年
关键词：
Compendex;
D O I：
暂无
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学科分类号：
摘要：
Electronic cooling - Liquids
引用
收藏
页码：101 / 102
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