Thermo-mechanical fatigue and isothermal low cycle fatigue life evaluation of Sn-0.7Cu-0.3Ag

被引：0
|
作者：
Hiyoshi, Noritake [1 ]
机构：
[1] Department of Mechanical Engineering, Ishikawa National College of Technology, Kita-chujyo, Tsubata, Ishikawa 929-0392, Japan
来源：
Journal of Japan Institute of Electronics Packaging | 2013年 / 16卷 / 06期
关键词：
Compilation and indexing terms; Copyright 2024 Elsevier Inc;
D O I：
10.5104/jiep.16.463
中图分类号：
学科分类号：
摘要：
Copper alloys - Isotherms - Lead-free solders - Tin alloys - Fatigue testing - Tensile testing - Parameter estimation - Thermal expansion - Low-cycle fatigue
引用
收藏
页码：463 / 469
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