Plasma Evolution of Surface Flashover Form Process in Vacuum by 2D PIC-DSMC Code

被引：0
作者：
Xu A. [1 ]
Jin D. [1 ]
Cheng Y. [1 ]
Chen L. [1 ]
Tan X. [1 ]
机构：
[1] Institute of Electronic Engineering, China Academy of Engineering Physics, Mianyang
来源：
Xu, Ao (xuao@caep.cn) | 2018年 / Science Press卷 / 44期
关键词：
Field emission; Insulator; Plasma; Simulation; Surface flashover;
D O I：
10.13336/j.1003-6520.hve.20180828030
中图分类号：
学科分类号：
摘要：
The surface flashover is a major limitation to high-voltage components in vacuum, therefore it is important to master the main factors which affect the plasma formation and evolution in surface flashover for further enhancing the insulating performances of relative components. We established a simulation model of the surface flashover in 1 mm vacuum gap by a 2D PIC-DSMC code, in which some basic physical processes, such as field emission in the vicinity of the metal-vacuum-dielectric junction, charge accumulation effect in insulator surface, secondary electron emission, gas desorption, and electrons interact with gas etc, were considered. Then, the temporal and spacial density distribution of electrons, ions and neutral particles are presented. The enhancement of electric field on cathode surface and the increases of field emission electrons induced by the charge accumulation effect on insulator surface is revealed. Finally, it is indicated that surface flashover is formed as massive ions appearing near the cathode to enhance field emission. The results provide a base for further understanding the surface flashover in vacuum and further enhancing the performances of components. © 2018, High Voltage Engineering Editorial Department of CEPRI. All right reserved.
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页码：3001 / 3008
页数：7
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