High-Speed Copper and Coaxial Broadband

被引:0
|
作者
Maes, Jochen [1 ]
Strobel, Rainer [4 ]
Rawi, Anas Al [2 ]
Ben-Ghorbel, Mahdia [3 ]
机构
[1] Fixed Networks Group Within Nokia Bell Labs
[2] BT Labs
[3] EXFO, Canada
[4] Intel
来源
IEEE Communications Magazine | 2019年 / 57卷 / 08期
关键词
D O I
10.1109/MCOM.2019.8808153
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [41] EFFECTS OF ADDITIVES ON HIGH-SPEED COPPER PLATING
    SHYU, JH
    KLINE, GA
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (08) : C353 - C353
  • [42] High-speed copper access: a tutorial overview
    Czajkowski, IK
    ELECTRONICS & COMMUNICATION ENGINEERING JOURNAL, 1999, 11 (03): : 125 - 148
  • [43] HIGH-SPEED VIDEO WITH PULSED COPPER LASERS
    ABRAHAMS, B
    MALLAN, A
    LASER FOCUS-ELECTRO-OPTICS, 1984, 20 (07): : 54 - &
  • [44] Pulsed broadband incoherent illumination for high-speed and ultrahigh-speed imaging
    Root, RG
    26TH INTERNATIONAL CONGRESS ON HIGH SPEED PHOTOGRAPHY AND PHOTONICS, 2005, 5580 : 270 - 281
  • [45] A protocol structure for high-speed communication over broadband ISDN
    Haas, Zygmunt
    IEEE Network, 1991, 5 (01): : 64 - 70
  • [46] Latest development of broadband high-speed power line telecommunication
    Chen, C.D.
    Liu, H.T.
    Zhang, B.H.
    Zhongguo Dianli/Electric Power, 2001, 34 (04):
  • [47] Impact of high-speed broadband access on local establishment dynamics
    Falk, Martin
    Hagsten, Eva
    TELECOMMUNICATIONS POLICY, 2021, 45 (04)
  • [48] High-Speed Broadband Quantum Efficiency Determination of Solar Cells
    Missbach, Thomas
    Straub, Reinhold S. L.
    Benkhoff, Tobias M.
    Siefer, Gerald
    IEEE JOURNAL OF PHOTOVOLTAICS, 2017, 7 (05): : 1384 - 1389
  • [49] Implementation of a broadband equalizer for high-speed wireless data applications
    Durant, GM
    Ariyavisitakul, S
    ICUPC '98 - IEEE 1998 INTERNATIONAL CONFERENCE ON UNIVERSAL PERSONAL COMMUNICATIONS, VOLS 1 AND 2, 1998, 1-2 : 1015 - 1020
  • [50] High-speed circuit designs for transmitters in broadband data links
    Lee, J
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2006, 41 (05) : 1004 - 1015