A coupled thermal-structural finite element analysis of a single pulse micro-EDM process

被引：1
作者：
机构：
[1] Key Laboratory of Micro-systems and Micro-structures Manufacturing (HIT), Ministry of Education
[2] Harbin Institute of Technology (HIT), School of Mechanical Engineering, Harbin
来源：
| 1600年 / Trans Tech Publications Ltd卷 / 579-580期
关键词：
Coupled thermal-structural model; Finite element analysis; Micro-EDM;
D O I：
10.4028/www.scientific.net/KEM.579-580.86
中图分类号：
学科分类号：
摘要：
A three-dimensional coupled thermal-structural model for micro electrical discharge is presented in this paper. Temperature field and thermal stress field of a single spark discharge process are analysed using this model by indirect coupling method. Temperature field is firstly solved which acts as the foundation of solving thermal stress field. To make the simulation results more reliable, these important elements are also taken into account, such as temperature-dependent properties of material, the phenomenon of plasma channel radius expanding, the percentage of discharge energy transferred to the workpiece and Gaussian distribution of heat flux. The results can explain the formation of cracks around the discharge crater. The thickness of the white layer and residual stresses can be predicated using this model.
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页码：86 / 90
页数：4
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