The effect of leadframe oxidation of a quad flat no-lead semiconductor package under cyclic loading

This study presents a new cyclic test for the QFN package using the oxidised leadframe and good leadframe, namely the three-point assembly fixture with a rounded contact surface test method. The fixture of the test method is a test assembly that supports a specimen on two anvils or rollers and symmetrically loads the specimen on the opposite surface with an anvil or roller using Micro Tester; a micro tensile tester incorporating a deflection measuring device shall be used to generate a controlled board deflection rate. The validity of the mechanical test method can then be verified based on the stress analysis results and also be obtained in the experiments. Considering the QFN package delamination, lead cracking, package body cracking and cracking between the various lead statistically based on the experiments, it was shown during cyclic loads and the temperature conditions for the QFN package for delamination can be observed. © 2008 Asian Network for Scientific Information.