Flow and heat transfer characteristics of micro-channel cooling chip at non-uniform heat flux

被引:0
作者
Shen L. [1 ]
Ji J. [1 ]
Luo F. [2 ]
Chen J. [1 ]
Xie J. [1 ]
Huang T. [1 ]
机构
[1] School of Energy and Power Engineering, Huazhong University of Science and Technology, Wuhan
[2] China National Tobacco Corporation Hunan Branch, Changsha
来源
Zhongnan Daxue Xuebao (Ziran Kexue Ban)/Journal of Central South University (Science and Technology) | 2021年 / 52卷 / 06期
基金
中国国家自然科学基金;
关键词
Flow and heat transfer characteristics; Micro-channel; Non-uniform heat flux; VOF(volume of fluid) method;
D O I
10.11817/j.issn.1672-7207.2021.06.010
中图分类号
学科分类号
摘要
The influence of local hot spot on the flow pattern, temperature, heat transfer coefficient and pressure drop in the microchannel was analyzed numerically by the VOF(volume of fluid) method to explore the flow and heat transfer characteristics of microchannel cooling chip at non-uniform heat flux. The results show that with the increase of heat flux and the decrease of velocity, overall flow pattern presents a process from bubble flow to annular flow, while the increase of heat flux at hot spot doesn't remarkably change the overall flow pattern in the micro-channel. The increase of heat flux at hot spot causes the temperature of this area to rise rapidly, the temperature fluctuation is greatly magnified, and the temperature of wall fluctuates as high as 250 K at the heat flux of 500 W/cm2 at hot spot. The heat transfer coefficient shows a tendency to increase firstly and then decrease. The increase of heat flux at hot spot will enhance the heat transfer coefficient and reduce the heat transfer coefficient of the latter part of the channel to a certain extent. The pressure drop in the microchannel is influenced by flow rate and overall heat flux, and the growth of heat flux at hot spot has little effect on the stability of pressure drop in micro-channel. © 2021, Central South University Press. All right reserved.
引用
收藏
页码:1809 / 1816
页数:7
相关论文
共 22 条
[1]  
MOORE G E., Cramming more components onto integrated circuits, Proceedings of the IEEE, 86, 1, pp. 82-85, (1998)
[2]  
GAO Xianxian, CHEN Yixin, SHEN Limei, Et al., Simulation of 3D-ICS for liquid cooling of interlayer microchannels, Refrigeration and Air-conditioning, 20, 2, pp. 35-39, (2020)
[3]  
GUO Zengyuan, Frontier of heat transfer: microscale heat transfer, Advances in Mechanics, 30, 1, pp. 1-6, (2000)
[4]  
TUCKERMAN D B, PEASE R F W., High-performance heat sinking for VLSI, IEEE Electron Device Letters, 2, 5, pp. 126-129, (1981)
[5]  
LING Kong, SON Gihun, SUN Dongliang, Et al., Three dimensional numerical simulation on bubble growth and merger in microchannel boiling flow, International Journal of Thermal Sciences, 98, pp. 135-147, (2015)
[6]  
SAISORN S, KAEW-ON J, WONGWISES S., Flow pattern and heat transfer characteristics of R134a refrigerant during flow boiling in a horizontal circular mini-channel, International Journal of Heat and Mass Transfer, 53, 19, pp. 4023-4038, (2010)
[7]  
YANG Qingchuan, SHU Bifen, WANG Jing, Et al., Experimental investigation on flow boiling heat transfer and flow patterns in a single micro-channel with large mass velocity, Experimental Thermal and Fluid Science, 91, pp. 283-291, (2018)
[8]  
THIANGTHAM P, KEEPAIBOON C, KIATPACHAI P, Et al., An experimental study on two-phase flow patterns and heat transfer characteristics during boiling of R134a flowing through a multi-microchannel heat sink, International Journal of Heat and Mass Transfer, 98, pp. 390-400, (2016)
[9]  
THOME J R, CONSOLINI L., Mechanisms of boiling in microchannels: critical assessment, Microfluidics Based Microsystems, pp. 83-105, (2010)
[10]  
MARKAL B, AYDIN O, AVCI M., An experimental investigation of saturated flow boiling heat transfer and pressure drop in square microchannels, International Journal of Refrigeration, 65, pp. 1-11, (2016)