MEMS for mobile communications

被引：0

作者：

Ermolov, Vladimir

Nieminen, Heikki

Nybergh, Kjell

Ryhanen, Tapani

Silanto, Samuli

机构：

来源：

Circuits Assembly | 2002年 / 13卷 / 07期

关键词：

Capacitors - Chip scale packages - Hermetic seals - Integrated circuits - Micromachining - Mobile telecommunication systems - Plasma etching - Silicon wafers - Thermodynamic stability - WSI circuits;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

The packaging of radio frequency microelectromechanical systems (RF MEMS) for mobile communications is discussed. The requirements of the packaging solutions for microsystems are hermetic sealing, stability of the controlled gas pressure in some applications, thermal and mechanical stability and the use of materials and designs to achieve high quality RF characteristics. Wafer-level packaging of RF MEMS is explained using an MEM tunable capacitor. Micromachining for RF packaging is also discussed.

引用

页码：46 / 47