Experimental investigation on the heat dissipation for high-power LED arrays using an active and passive combination structure of dual synthetic jets and a fin

In order to better solve the heat dissipation of high-power light-emitting diode (LED) and facilitate its integration, an active and passive combination method is proposed based on dual synthetic jets and a fin. The comparative analysis of four different heat dissipation methods is executed on their heat dissipation characteristics. The heat dissipation characteristics of dual synthetic jets (DSJs) are investigated on different LED powers and jet-to-surface distances, and compared with those of the commercial LED product. The results indicate that the chip temperature rapidly decreases and tends to be stable using DSJ single cooling, but the stable temperature is about 9.8 higher than that using the commercial fin. However, the heat dissipation effect is significantly enhanced and the stable temperature further drops 15 using the combination structure with respect to the commercial fin. The effects of jet-to-surface distance on the heat dissipation performance of DSJ are roughly consistent, and an optimal cooling effect is achieved when the jet-to-surface distance is about 20 mm for LED array chips with different powers. In addition, the effect of jet-to-surface distance on the combination structure is complicated but not remarkable. The stable temperatures decrease within 14.4-24.4 using the combination structure at different jet-to-surface distances compared with the commercial LED product, which demonstrates that the combination structure not only can enhance the heat dissipation effect for the LED array chips, but also make the installation more flexible, thus to effectively reduce the installation space of the heat dissipation structure.