Molecular dynamics simulations of deformation behaviors for nanocrystalline Cu/Ni films under different strain rates

被引：0

作者：

Cheng, Cong ^{[1
,2
]}

Chen, Shang-Da ^{[1
,2
]}

Wu, Yong-Zhi ^{[1
,2
]}

Huang, Hong-Xiang ^{[1
,2
]}

机构：

[1] Faculty of Materials, Optoelectronics and Physics, Xiangtan University, Xiangtan, 411105, Hunan

[2] Key Laboratory of Low Dimensional Materials and Application Technology (Ministry of Education), Xiangtan University, Xiangtan, 411105, Hunan

来源：

Cailiao Gongcheng/Journal of Materials Engineering | 2015年 / 43卷 / 03期

关键词：

Cu/Ni film; Molecular dynamics; Nanocrystalline; Strain rate;

D O I：

10.11868/j.issn.1001-4381.2015.03.011

中图分类号：

学科分类号：

摘要：

Molecular dynamics simulations are carried out to investigate the deformation behaviors and mechanical properties of nanocrystalline Cu/Ni films under conditions of tensile strain at different strain rates. The results indicate that the Cu/Ni films have higher yield strength and higher strain rate sensitivity (m) at the higher strain rate. The nucleation of voids in Cu/Ni multilayers' interface is observed at a strain rate of 108s-1, whereas spallation in nanocrystalline Cu films is appeared at a strain rate of 1010s-1. For the higher strain rate loading conditions, the FCC, HCP, and OTHER atomic groups are changed significantly both in Cu and Ni films. However, striking structural changes are found only in the Cu films under conditions of tensile strain at lower strain rate. The simulation results show that increasing strain rates are benefit to the formation of HCP structure, while if the strain rates exceed a certain value, the increasing disorder atomic groups may impede the growth of HCP atomic groups. ©, 2015, Cailiao Gongcheng/Journal of Materials Engineering. All right reserved.

引用

页码：60 / 66

页数：6

共 30 条

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