Physical and Functional Reverse Engineering Challenges for Advanced Semiconductor Solutions

被引：0

作者：

Lippmann, Bernhard ^{[1
]}

Bette, Ann-Christin ^{[1
]}

Ludwig, Matthias ^{[1
,2
]}

Mutter, Johannes ^{[1
]}

Baehr, Johanna ^{[2
]}

Hepp, Alexander ^{[2
]}

Gieser, Horst ^{[3
]}

Kovac, Nicola ^{[3
]}

Zweifel, Tobias ^{[3
]}

Rasche, Martin ^{[4
]}

Kellermann, Oliver ^{[4
]}

机构：

[1] Infineon Technologies Ag, Munich, Germany

[2] Technical University of Munich, Department of Electrical and Computer Engineering, Munich, Germany

[3] Fraunhofer Emft, Munich, Germany

[4] Raith GmbH, Dortmund, Germany

来源：

Proceedings of the 2022 Design, Automation and Test in Europe Conference and Exhibition, DATE 2022 | 2022年

关键词：

Compendex;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Hardware security

引用

页码：796 / 801