THERMAL MANAGEMENT OF THE HOTSPOTS IN 3-D INTEGRATED CIRCUITS

被引：13

作者：

Wang, Kang-Jia ^{[1
]}

Sun, Hong-Chang ^{[2
,3
]}

Li, Cui-Ling ^{[4
]}

Wang, Guo-Dong ^{[1
]}

Zhu, Hong-Wei ^{[1
]}

机构：

[1] Henan Polytech Univ, Sch Phys & Elect Informat Engn, Jiaozuo, Peoples R China

[2] Shandong Univ, Sch Control Sci & Engn, Jinan, Shandong, Peoples R China

[3] Shandong Dawei Int Architectural Design Co LTD, Mech & Elect Design Inst, Jinan, Shandong, Peoples R China

[4] Huizhou Econ & Polytech Coll, Coll Informat Engn, Huizhou, Peoples R China

来源：

THERMAL SCIENCE | 2018年 / 22卷 / 04期

关键词：

thermal; 3-D integrated circuit; micro-channel; thermal through-silicon vias; 3D ICS; DESIGN;

D O I：

10.2298/TSCI1804685W

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

Vertical integration for microelectronics possesses significant challenges due to its fast dissipation of heat generated in multiple device planes. This paper focuses on thermal management of a 3-D integrated circuit, and micro-channel cooling is adopted to deal with the 3-D integrated circuitthermal problems. In addition, thermal through-silicon vias are also used to improve the capacity of heat transmission. It is found that combination of microchannel cooling and thermal through-silicon vias can remarkably alleviate the hotspots. The results presented in this paper are expected to aid in the development of thermal design guidelines for 3-D integrated circuits.

引用

页码：1685 / 1690

页数：6

共 21 条

[1]

Brunschwiler T, 2016, J ELECTRON PACKAGING, V138

[2] Integrated Microfluidic Cooling and Interconnects for 2D and 3D Chips [J].

Dang, Bing ;

Bakir, Muhannad S. ;

Sekar, Deepak Chandra ;

King, Calvin R., Jr. ;

Meindl, James D. .

IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2010, 33 (01) :79-87

[3] Fast Thermal Analysis on GPU for 3D ICs With Integrated Microchannel Cooling [J].

Feng, Zhuo ;

Li, Peng .

IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2013, 21 (08) :1526-1539

[4] Parallel On-Chip Power Distribution Network Analysis on Multi-Core-Multi-GPU Platforms [J].

Feng, Zhuo ;

Zeng, Zhiyu ;

Li, Peng .

IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2011, 19 (10) :1823-1836

[5] Recent advances in microscale pumping technologies: a review and evaluation [J].

Iverson, Brian D. ;

Garimella, Suresh V. .

MICROFLUIDICS AND NANOFLUIDICS, 2008, 5 (02) :145-174

[6]

Kandlikar S.G, 2014, J ELECTRON PACKAGING, V136, P456

[7] A liquid cooling solution for temperature redistribution in 3D IC architectures [J].

Kearney, Daniel ;

Hilt, Thierry ;

Pham, Pascale .

MICROELECTRONICS JOURNAL, 2012, 43 (09) :602-610

[8] A numerical hydrodynamic and thermal characterization of an inter-strata liquid cooling solution for 3D ICs [J].

Kearney, Daniel ;

Hilt, Thierry ;

Pham, Pascale .

MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2012, 18 (02) :225-235

[9] Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional Integrated Circuits With Nonuniform Heat Flux [J].

Kim, Yoon Jo ;

Joshi, Yogendra K. ;

Fedorov, Andrei G. ;

Lee, Young-Joon ;

Lim, Sung-Kyu .

JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 2010, 132 (04) :1-9

[10] IC thermal simulation and Modeling via efficient multigrid-based approaches [J].

Li, Peng ;

Pileggi, Lawrence T. ;

Asheghi, Mehdi ;

Chandra, Rajit .

IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2006, 25 (09) :1763-1776

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